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121. The bonding models of large π bond, hydrogen bond, HOMO and LUMO are discussed.

122. Gullibility : Measure of speed of paper adhesive bonding and its strength.

123. So you can see that polar covalency is a tendency towards ionic bonding.

124. The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.

125. Pitching vibration of ultrasonic bonding transducer can affect the bonding quality of IC.

126. The deep electron traps accelerated the electron decay because of the strong bonding or deep electron trap as recombination center.

127. In many cases crash damage is reparable by cutting out broken sections of carbon fibre and bonding in new ones.

128. The calcium bonding with fatty acids prevents the product from being reacted upon in the rumen stage thereby providing the crucial "inertness".

129. In the preceding section we discussed the valence bond ( VB ) or electron - pair theory of bonding.

130. For public works, the perspective of the Owner's Payment Bonding System may be varied due to different project organization models.

131. Now some non - financial organ is mainly the Bonding company adds on the petty loan company again.

132. Solder Bumps: Round solder balls bonded to the pads of components used in face-down bonding techniques.

133. Finally, wire bonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

134. So if we take a look at nitrogen here, what you'll notice is we have thre available for bonding, - and we already have our lone pair -- one of our orbitals is already filled up.

135. The text introduced the test method and application in some special instances about Information technology equipment Protective Bonding Conductor in Type test and Routing test.

136. This brings a fair bit of tension into the police dynamic of the film, with a lot of tough-guy chest thumping and male bonding.

137. The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.

138. From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.

139. The inherent disadvantages of conventional bonding and encapsulation technology restrict the range of application.

140. Bonding process of cold forming with ply pressure is introduced, and compared with hot-press approach.

141. The ipomoea batatas starch is used as the primary material to produce bonding agent SB-237, building coating of interiors and starch adhesive for corrugated board.

142. The network bonding point is firm, but is not slip. The ball shaped plastic avoids the network contacting floor directly, and reduces abrasion, further prolonging the net service life.

143. To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.

144. So, up here, atomic theory, periodic table, bonding, structures and molecules.

145. In ceramic industry, CMC can be used as a bonding adhesive, plasticizer, glaze suspending agent, color fixing agent,(sentence dictionary) etc.

146. Through the blending test, it has proved that the bonding strength of Cement-Stabilized Soil (CSS) could be improved while microcrystal was mixed into as addition agent.

147. A special design to produce 2-5 layers bonding from feeding raw material, ultrasonic welding, slitting to rewinding filter bag with automatic mechanism.

148. Bonding company: Company which issues performance Bonds , payment Bonds and other kinds of Bonds.

149. The type of structure and the density of pellet flocs are determined by the equilibrium condition of their inner bonding forces with the external forces exerting on it.

150. Wear-resisting, flame retardancy is good, have self-extinguishing RTV silicone compound, of glass, ceramics, metal good bonding.