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91, What uses will they find for a silicon chip?

92, Silicon is usually added by co - evaporation.

93, The silicon chips are less than a millimeter thick.

94, The pertinent siloxane compounds contain two silicon hydride bonds.

95, Silicon complementary NPN transistor. Audio amplifier, driver.

96, The methods of 3D interconnection can be classified into the wire bonding, flip chip, through silicon via(TSV) and film wire technology, whose advantages and disadvantages are analyzed.

97, Using both pure poly emitter and heavily doped base, a CMOS-compatible silicon bipolar transistor is implemented, which has low base resistance and is suitable for low temperature operation.

98, A new technology for fabrication of silica on silicon arrayed waveguide grating (AWG) based on deep etching and thermal oxidation is presented.

99, Silicon Valley may prove a classroom for building a global business.

100, The measurement of pressure was carried out by using semiconductor silicon piezometer. With the static pressure in inlet of pipeline and theoretic analysis we could get the total pressure of MPT.

101, Energy gap and minority-carrier recombination lifetime are important physical parameters in the emitter of silicon transistor.

102, This paper aims at designing a relaxation oscillator which is used in the readout circuits for silicon capacitive accelerometers with CMOS process.

103, The chemical etching method wa applied to form surface texture of multicrystalline silicon in order to reduce the reflectance of the surface.

104, Silicon power rectifier diode. Cathode to case. Peak reverse voltage 600V. Max forward current 30A.

105, The effects of surface thermal oxidation on the minority carrier lifetime of Czochralski (CZ) silicon wafers are investigated by photoconductive decay (PCD) method.

106, OBJECTIVE:To comprehensively analyze the application values of silicon rubber in the design of artificial organs, medical apparatus(sentencedict.com), facial plastic surgery and medical release system.

107, Silicon bilateral voltage triggered switch. Breakover voltage 205V (min) to 230V (max).

108, The production practice shows that addition of a proper amount of phosphoric acid for bricking of silicon carbide tray of the re-distiller is favorable for extending lifetime of the re-distiller body.

109, At present, the research indicated that, introducing the silicon alkyl radical in the organotin may be possible to reduce the toxicity of the organotin.

110, The silicon atom occupies the space opening( interstice)between the oxygen atoms and shares four valence electrons with the four oxygen atoms.

111, SiC/C binary porous green body was prepared by electrophoretic deposition process, using 70%water-30%alcohol as dispersion medium, and silicon carbide and petroleum coke powder as starting materials.

112, Sensor element, which consists of a Fabry-Perot etalon fabricated from single-crystal silicon,[www.Sentencedict.com] connects with the LED and detector by fibers.

113, High reactive penta-coordinated organic silicon was prepared via the reaction of silica with ethylene glycol and potassium hydroxide.

114, Other Ingredients: dibasic calcium phosphate, stearic acid, modified cellulose gum, magnesium stearate and colloidal silicon dioxide.

115, A silicon - chip agnosticism can be shaken by many puzzles besides the creation.

116, The photoelectric transition property of Silicon photo - voltaic Cell was examined theoreticallyand experimentally.

117, At present, the silicon accelerometer base on mutual inductance variety have many thesis report in fremdnees, but no any thesis repot in home.

118, Three fabrication processes, including (i) wet etching, (ii) the selective epitaxial growth (SEG) on silicon wafers, and (iii) using silicon on insulator (SOI) wafers, were studied.

119, U.S. officials said the nine materials covered by their case were bauxite, coke, fluorspar, magnesium, manganese, silicon carbide, silicon metal, yellow phosphorus and zinc.

120, The invention provides a method for soldering aluminum silicon carbide composite and kovar alloy used in microelectronic encapsulation and pertains to the field of metal shell encapsulation.