Similar words: loafer, waft, waffle, luftwaffe, a few, safe, cafe, not a few. Meaning: ['weɪfə(r)] n. 1. a small adhesive disk of paste; used to seal letters 2. a small thin crisp cake or cookie 3. thin disk of unleavened bread used in a religious service (especially in the celebration of the Eucharist).
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91. These vendor functions must be integrated for functions such as wafer fabrication, wafer test, module build, and module test.
92. A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
93. During the testing of the integrated circuit (404), it communicates in the wafer test mode .
94. The effect of rapid thermal processing(RTP) on oxygen precipitates profile and denude zone(DZ) in Czochralski(CZ) silicon wafer during simulating CMOS processing is investigated.
95. Die: Integrated circuit chip as diced or cut from a finished wafer.
96. To make the criteria and method with no loss and fasting resolution for received wafer and mixed-up wafer, apply to produce.
97. Crater - Visible under diffused illumination, a surface imperfection on a wafer that can be distinguished in!
98. Wafer has been an effective rotation player, averaging 9.7 points and 17.8 minutes in the playoffs.
99. Lithographic tools for transferring Lilliputian circuitry onto a wafer cost up to $ 50 m a pop.
100. Egyptian priests practiced "transubstantiation", claiming to be able to transfer the sun god Osiris into a circular wafer.
101. It's suitable to have shell test and seal test for flanged end butterfly valves and wafer type butterfly valves.
102. In this study, ozonized water in the single wafer processor was used to study photoresist stripping.
103. Therefore, to predict and control the evaporation rate of IPA inside nano-pores on the wafer surface has great significance for wafer manufacturing.
104. A thin , crisp wafer or biscuit, usually made of unsweetened dough.
105. WAT ( Wafer Acceptance Test ) is a very important stage of process.
106. Tetrahedral amorphous carbon (ta-C) films have been deposited on P-type (100) polished c-silicon wafer with different substrate negative bias by filtered cathodic vacuum arc technology.
107. Measures have been discussed for preventing the Al film for being pierced through by the probe in wafer probing on the 1034 Wafer prober.
108. A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.
109. Mainly applies in the print circuit wafer, is electronics industries and so on the electronic accounting machine as well as communication equipment the essential foundation material.
110. The drilling machine for large glass wafer processing is a production machine for silicon pressure sensors.
111. RAINBOW (Reduced And Internally Biased Oxide Wafer)piezoelectric ceramics are a new type of stress-biased, unreduced -reduced composite ceramics,[http://sentencedict.com/wafer.html] which have a special arc structure.
112. Hot plate with silicon wafer in initial configuration ( before heating ).
113. In this work, RAFT grafting polymerizations from silicon wafer were investigated.
114. JCF: I don't know if you're aware of this, but our play-by-play guy Craig Ackerman won't stop gushing about Von, and has even confessed to having a serious man-crush on Mr. Wafer.
115. This is achieved by using a unique multi beam technology, demonstrated in figure 2, which reduces the power density, minimizes the thermal load, and reduces the kerf width in the wafer.
116. To smooth the surface of a wafer or semiconductor crystal.
117. The Plasma Batch System 300 is a compact Microwave Plasma Batch System for resist ashing and wafer cleaning in semiconductor applications.
118. Pit - A non - removable imperfection found on the surface of a wafer.
119. So, if 20 areas have defects from dust or scratches on a single wafer generating 2,000 LSI chips, there would still be at least 1,980 usable chips in the batch.
120. Wafer chip scale packaging(WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.
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